Products

Toray MicroPly™ TC4015 cyanate ester film adhesive, formulated for low moisture absorption and high temperature bond strength applications. Its strength and toughness when bonding is often greater than epoxy and polyimides especially at high temperatures.

Toray MicroPly™ TC310 is a toughened epoxy film adhesive with excellent mechanical properties and toughness. It is ideal for honeycomb or laminate bonding and may be cured in either autoclave or vacuum bag processing.

Toray MicroPly™ TC263 is a toughened, high peel strength, structural epoxy film adhesive for honeycomb core and laminate bonding. It may be used in low pressure vacuum only, out-of-autoclave processes or in autoclave processes at 15 psi.

Toray MicroPly™ RS-4A is a cyanate ester based film adhesive developed to provide good adhesive performance for core / face skin structures, co-curing and secondary bonding.

Toray MicroPly™ RS-15H is an epoxy film adhesive highly flexible with respect to processing. It is compatible with the Toray RS-1 family of prepregs, with all types of reinforcements and cores. It is also suitable for secondary bonding.

Toray MicroPly™ EX-1543 cyanate ester film adhesive formulated for low moisture absorption and/or low dielectric constant and loss applications. It provides strength and toughness when bonding solid, honeycomb or foam core structures at high temperatures.

Toray MicroPly™ EX-1516 cyanate ester film adhesive which has been formulated for low moisture absorption and / or low dielectric constant and loss applications. It provides strength and toughness when bonding solid, honeycomb or foam core structures.

Toray MicroPly™ EF8020 is a modified, high-strength, structural epoxy film adhesive for honeycomb core and laminate bonding. EF8020 is compatible for co-cure with Toray’s 8020 prepreg and SC8020 syntactic core.

Toray MicroPly™ EF72 is a modified, high-strength, structural epoxy film adhesive for honeycomb core and laminate bonding. EF72 is compatible for co-cure with many of Toray’s E700 series prepregs that cure at 120°C.