Products

Toray MicroPly™ TCF4035 is a syntactic epoxy film compatible with 121°C (250°F) prepregs. It features a long out time and is offered in a density of approximately 0.6 g/cc (40 ± 4 pounds per cubic foot).

Toray MicroPly™ TCF4001 cyanate ester syntactic foam is unique in the industry due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and can be machined to shape.

Toray MicroPly™ TC4015 cyanate ester film adhesive, formulated for low moisture absorption and high temperature bond strength applications. Its strength and toughness when bonding is often greater than epoxy and polyimides especially at high temperatures.

Toray MicroPly™ SF-4 is a BMI syntactic film with excellent elevated temperature properties and compatibility to Toray RS-8HT. It is available in unsupported and supported continuous film form in thicknesses from 0.25–2.5 mm (10–100 mils).

Toray MicroPly™ RS-4A is a cyanate ester based film adhesive developed to provide good adhesive performance for core / face skin structures, co-curing and secondary bonding.

Toray MicroPly™ EX-1543 cyanate ester film adhesive formulated for low moisture absorption and/or low dielectric constant and loss applications. It provides strength and toughness when bonding solid, honeycomb or foam core structures at high temperatures.

Toray MicroPly™ EX-1541 cyanate ester syntactic foam is unique due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and is easily machined to shape if required.

Toray MicroPly™ EX-1516 cyanate ester film adhesive which has been formulated for low moisture absorption and / or low dielectric constant and loss applications. It provides strength and toughness when bonding solid, honeycomb or foam core structures.

Toray MicroPly™ EM-5A is an expanding cyanate ester syntactic film (core splice). Its' unexpanded density is approximately 0.80 g/cc (50 pcf) and it exhibits an expansion ratio of up to 4 times. It is available in continuous film rolls or in sheet form.

Toray AmberTool® TC40 is a BMI composite tooling prepreg, which provides excellent elevated temperature properties and processability. Toray AmberTool® TC40 has been designed for high temperature tooling applications.

Toray AmberTool® HX56 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 180ºC (356ºF) is achieved. Toray AmberTool® HX56 achieves an excellent surface finish for small to medium sized autoclave tooling.

Toray AmberTool® HX42 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 210°C (410°F) is achieved. Toray AmberTool® HX42 has proven pedigree in aerospace tooling.

Toray AmberTool® HX40 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 190ºC (374ºF) is achieved. Toray AmberTool® HX40 is ideal for high temperature larger scale tooling.

Toray TC750 is a toughened epoxy component prepreg developed for structural applications within high performance automotive. TC750 facilitates curing from 80°C (176°F) to 180°C (356°F) and can be pre-impregnated into a range of fiberand fabric types.

TC420 is a flow controlled cyanate ester prepreg, toughened to resist microcracking. TC420 is ideal for out of autoclave large structures in ultra high temperature applications. It is easy to process and yields a low void content under vacuum bag only.

Toray TC346 is a high temperature epoxy component prepreg developed for structural applications within Formula 1 and high performance automotive.

TC275-1 is a dual cure toughened epoxy prepreg designed to facilitate composite part construction with low pressure or vacuum pressure cures. TC275-1’s out time allows the lay-up of thick or larger composite structure.

Toray’s TC250 offers an excellent balance of toughness, mechanical properties, and hot/wet performance. It is easily processed via low pressure vacuum bag/oven or under autoclave. TC250 can be post cured for a higher dry and wet Tg.

RS-8HT is a BMI resin which provides excellent elevated temperature properties and processability. RS-8HT has been evaluated and qualified in the areas of satellite and airframe / missile structures.

RS-17B is a modified epoxy prepreg. RS-17B delivers extremely low moisture absorption, excellent mechanical properties, toughness, and modulus. RS-17B is a flexible cure system which may be cured from 135°C-177°C. RS-17B has a long space flight heritage.

MS-1H is carbon fiber / epoxy resin compression molding system using high modulus PAN carbon fiber. MS-1H is an excellent high stiffness BMC, qualified to military and commercial applications MS-1H is offered with 1” or ½” carbon fibers for smaller parts.

MS-1A is a high-performance carbon fiber / epoxy resin compression molding system based on high modulus carbon fiber. MS-1A compression molding compound yields unparalleled stiffness and high strength. MS-1A is qualified for space applications.

BTCy-1 is a 177°C (350°F) curing cyanate ester prepreg and is an industry standard for use on satellite structures and radomes.

BT250E-6 resin system is a 121°C (250°F) cure epoxy with excellent strength and stiffness. It provides an outstanding surface finish under vacuum bag/oven cure. BT250E-6 has an FAA-accepted database on carbon IM-7 UD tape, S2-glass, and AS-4C plain weave.

8020 toughened epoxy component prepreg offers an excellent balance of mechanical properties and excellent surface finish. The Toray 8020 resin system has been developed to offer a long outlife and flexible cure schedules from 70-130°C (158-266°F).