Products

Toray MicroPly™ TCF4045 is a low-density epoxy syntactic film. It displays both good mechanical and low dielectric loss and constant properties. The material's base resin chemistry features low moisture absorption with good high temperature properties.

Toray MicroPly™ TCF4035 is a syntactic epoxy film compatible with 121°C (250°F) prepregs. It features a long out time and is offered in a density of approximately 0.6 g/cc (40 ± 4 pounds per cubic foot).

Toray MicroPly™ TC310 is a toughened epoxy film adhesive with excellent mechanical properties and toughness. It is ideal for honeycomb or laminate bonding and may be cured in either autoclave or vacuum bag processing.

Toray MicroPly™ TC263 is a toughened, high peel strength, structural epoxy film adhesive for honeycomb core and laminate bonding. It may be used in low pressure vacuum only, out-of-autoclave processes or in autoclave processes at 15 psi.

Toray MicroPly™ TC235SF-1 is an epoxy composite surfacing film, allowing a smooth, paintable surface from tooling or, a thin-skinned honeycomb stiffened composite structure. It may be cured under vacuum only pressure or under low autoclave pressure.

Toray MicroPly SC72A is a low-density unsupported epoxy syntactic core. Offering reduced processing, a one-shot cure, the ability to anchor inserts or fastenings & increases the opportunity to consider lightweight, thin-walled composite sandwich structures

Toray AmberTool® HX56 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 180ºC (356ºF) is achieved. Toray AmberTool® HX56 achieves an excellent surface finish for small to medium sized autoclave tooling.

Toray AmberTool® HX40 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 190ºC (374ºF) is achieved. Toray AmberTool® HX40 is ideal for high temperature larger scale tooling.

Toray TC750 is a toughened epoxy component prepreg developed for structural applications within high performance automotive. TC750 facilitates curing from 80°C (176°F) to 180°C (356°F) and can be pre-impregnated into a range of fiberand fabric types.

TC350-1 is a toughened epoxy prepreg with mechanical property translation and excellent hot/wet performance. TC350-1 is easily processed via out of autoclave or press curing operations. TC350-1 is available in extensive fiber reinforcement formats.

TC275-1 is a dual cure toughened epoxy prepreg designed to facilitate composite part construction with low pressure or vacuum pressure cures. TC275-1’s out time allows the lay-up of thick or larger composite structure.

Toray’s TC250 offers an excellent balance of toughness, mechanical properties, and hot/wet performance. It is easily processed via low pressure vacuum bag/oven or under autoclave. TC250 can be post cured for a higher dry and wet Tg.

RS-36 is an advanced modified epoxy prepreg for structural composite applications. RS-36 offers an excellent balance of mechanical properties, low moisture absorption and a range of processing options. For a higher Tg, RS-36-1 is available

RS-17B is a modified epoxy prepreg. RS-17B delivers extremely low moisture absorption, excellent mechanical properties, toughness, and modulus. RS-17B is a flexible cure system which may be cured from 135°C-177°C. RS-17B has a long space flight heritage.

RS-1 is an epoxy prepreg which provides an excellent balance of mechanical properties, toughness and modulus. RS-1 has been evaluated and qualified in areas ranging from marine to aerospace. RS-1 is also available in a 80°C curing formulation.

MS-1A is a high-performance carbon fiber / epoxy resin compression molding system based on high modulus carbon fiber. MS-1A compression molding compound yields unparalleled stiffness and high strength. MS-1A is qualified for space applications.

E750 is a toughened epoxy component prepreg developed for structural applications within Formula 1 and high performance automotive. E750 allows curing from 80°C (176°F) to 180°C (356°F) and can be impregnated into a range of fiber and fabric types.

E732 is a snap cure toughened epoxy resin matrix optimized for press curing (compression molding) prepreg applications. With a cure time of 4 minutes at 160°C (320°F), an onset Tg of 170°C (338°F) is achieved.

E726 is a 120°C (248°F) cure toughened epoxy prepreg with controlled flow. E726 is designed for use within medical and industrial applications. E726 is compatible for co-cure with EF72 film adhesive and Amlite SC72A syntactic core.

E722 is a 120°C (248°F) cure toughened epoxy component prepreg. E722 is designed for structural applications in motorsport and marine industries and, a wide range of engineering applications.

E720 is a 120°C (248°F) cure toughened epoxy prepreg. E720 offers excellent adhesive properties, allowing direct lamination to honeycomb without the use of a film adhesive.

BT250E-6 resin system is a 121°C (250°F) cure epoxy with excellent strength and stiffness. It provides an outstanding surface finish under vacuum bag/oven cure. BT250E-6 has an FAA-accepted database on carbon IM-7 UD tape, S2-glass, and AS-4C plain weave.

BT250E-1 is a 121°C (250°F) cure epoxy prepreg with excellent toughness and strength. It provides an outstanding surface finish with VBO. BT250E-1 is self-adhesive to honeycomb and foam core and, is MIL-R-9300 qualified.

8020-FR is a modified epoxy component prepreg offers excellent structural properties, flame retardancy, and toughness. The Toray 8020-FR resin system has been developed to offer a long out life and flexible cure schedules from 70–120°C (158–248°F).

8020 toughened epoxy component prepreg offers an excellent balance of mechanical properties and excellent surface finish. The Toray 8020 resin system has been developed to offer a long outlife and flexible cure schedules from 70-130°C (158-266°F).