Product description
Toray MicroPly™ TCF4045 is a low dielectric, low density epoxy syntactic film. The material displays both good mechanical and dielectric properties. Toray MicroPly™ TCF4045’s base resin chemistry features low moisture absorption with good high temperature properties.
Product benefits/features
- Excellent low dielectric loss and constant
- Density of 0.61 g/cc (38.5 pcf)
Market segments
- Aerostructures
- eVTOL / Urban Air Mobility
- Radome
Details
| Product category | Syntactics |
| Processing | Autoclave Out of Autoclave / Vacuum bag |
| Resin type | Epoxy |
| Tg (Dry, onset) | 180 °C / 356 °F |
| Cure temperature (Optimal) | 179 °C / 354 °F |
| Cure temperature (Lowest) | 127 °C / 260 °F |
| Cure temperature (Highest) | 179 °C / 354 °F |
| Out life | 14 days |
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Need more information?
At Toray our goal is your success. If you have any questions or would like to learn more, please contact us.
Toray Advanced Composites UK
Need more information?
At Toray our goal is your success. If you have any questions or would like to learn more, please contact us.
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Toray Advanced Composites USA
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