Product description
Toray MicroPly™ TC310 is a toughened epoxy film adhesive for composite bonding with excellent mechanical properties and toughness. It is ideal for honeycomb or laminate bonding, and may be cured under autoclave or vacuum bag processing.
Product benefits/features
- Ideal composite bonding film adhesive
Market segments
- High Temperature
- Launch
- Space & Satellite
- Aerostructures
- Radome
- eVTOL / Urban Air Mobility
Details
Product category | Film Adhesives |
Processing | Out of Autoclave / Vacuum bag Press forming Autoclave |
Resin type | Epoxy |
Tg (Dry, onset) | 157 °C / 314 °F |
Cure temperature (Optimal) | 177 °C / 350 °F |
Cure temperature (Lowest) | 121 °C / 249 °F |
Cure temperature (Highest) | 177 °C / 350 °F |
Out life | 30 days |
Need more information?
At Toray our goal is your success. If you have any questions or would like to learn more, please contact us.
Toray Advanced Composites UK
Need more information?
At Toray our goal is your success. If you have any questions or would like to learn more, please contact us.