Product

Toray MicroPly™ TC310

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Product description

Toray MicroPly™ TC310 is a toughened epoxy film adhesive for composite bonding with excellent mechanical properties and toughness. It is ideal for honeycomb or laminate bonding, and may be cured under autoclave or vacuum bag processing.

Product benefits/features

  • Ideal composite bonding film adhesive

Market segments

  • High Temperature
  • Launch
  • Space & Satellite
  • Aerostructures
  • Radome

Details

Product category Film adhesives
Processing Out of Autoclave / Vacuum bag
Press forming
Autoclave
Resin type Epoxy
Tg (Dry, onset) 157 °C / 314 °F
Cure temperature (Optimal) 177 °C / 350 °F
Cure temperature (Lowest)121 °C / 249 °F
Cure temperature (Highest)177 °C / 350 °F
Out life 21 days

Need more information?

At Toray our goal is your success. If you have any questions or would like to learn more, please contact us. 

Toray Advanced Composites UK

Toray Advanced Composites UK
Send email+44 1773 530899

Need more information?

At Toray our goal is your success. If you have any questions or would like to learn more, please contact us. 

Toray Advanced Composites USA

Toray Advanced Composites USA
Send email+1 (408) 465 8500

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