Products

Toray MicroPly™ TCF4050 core splice adhesive is a cyanate ester-based core splice with flatwise tensile strength up to 260°C (500°F). This product has been developed to be compatible with Toray’s high temperature TC420 prepreg resin systems.

Toray MicroPly™ TCF4045 is a low-density epoxy syntactic film. It displays both good mechanical and low dielectric loss and constant properties. The material's base resin chemistry features low moisture absorption with good high temperature properties.

Toray MicroPly™ TCF4035 is a syntactic epoxy film compatible with 121°C (250°F) prepregs. It features a long out time and is offered in a density of approximately 0.6 g/cc (40 ± 4 pounds per cubic foot).

Toray MicroPly™ TCF4001 cyanate ester syntactic foam is unique in the industry due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and can be machined to shape.

Toray MicroPly™ TC4015 cyanate ester film adhesive, formulated for low moisture absorption and high temperature bond strength applications. Its strength and toughness when bonding is often greater than epoxy and polyimides especially at high temperatures.

Toray MicroPly™ TC310 is a toughened epoxy film adhesive with excellent mechanical properties and toughness. It is ideal for honeycomb or laminate bonding and may be cured in either autoclave or vacuum bag processing.

Toray MicroPly™ TC263 is a toughened, high peel strength, structural epoxy film adhesive for honeycomb core and laminate bonding. It may be used in low pressure vacuum only, out-of-autoclave processes or in autoclave processes at 15 psi.

Toray MicroPly™ TC235SF-1 is an epoxy composite surfacing film, allowing a smooth, paintable surface from tooling or, a thin-skinned honeycomb stiffened composite structure. It may be cured under vacuum only pressure or under low autoclave pressure.

Toray MicroPly™ SF-4 is a BMI syntactic film with excellent elevated temperature properties and compatibility to Toray RS-8HT. It is available in unsupported and supported continuous film form in thicknesses from 0.25–2.5 mm (10–100 mils).

Toray Cetex® TC1225 is an engineered thermoplastic composite material, utilizing a semi-crystalline engineered polyarlyetherketone resin for excellent mechanical performance and lower processing temperatures.

Toray Cetex® MC1322 PEKK is a thermoplastic BMC based upon TC1320 UD tape using high strength fibers in lengths of up to 25.4mm (1"). MC1322 allows complex shapes to be made with varying wall thickness, integrated ribs and reinforcing structures.

Toray Cetex® MC1200 PEEK is a thermoplastic BMC based upon TC1200 UD tape using high strength fibers in lengths of up to 25.4mm (1"). MC1200 allows complex shapes to be made with varying wall thickness, integrated ribs and reinforcing structures.

Toray AmberTool® HX40 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 190ºC (374ºF) is achieved. Toray AmberTool® HX40 is ideal for high temperature larger scale tooling.

TC420 is a flow controlled cyanate ester prepreg, toughened to resist microcracking. TC420 is ideal for out of autoclave large structures in ultra high temperature applications. It is easy to process and yields a low void content under vacuum bag only.

TC350-1 is a toughened epoxy prepreg with mechanical property translation and excellent hot/wet performance. TC350-1 is easily processed via out of autoclave or press curing operations. TC350-1 is available in extensive fiber reinforcement formats.

TC275-1 is a dual cure toughened epoxy prepreg designed to facilitate composite part construction with low pressure or vacuum pressure cures. TC275-1’s out time allows the lay-up of thick or larger composite structure.

Toray’s TC250 offers an excellent balance of toughness, mechanical properties, and hot/wet performance. It is easily processed via low pressure vacuum bag/oven or under autoclave. TC250 can be post cured for a higher dry and wet Tg.

RS-8HT is a BMI resin which provides excellent elevated temperature properties and processability. RS-8HT has been evaluated and qualified in the areas of satellite and airframe / missile structures.

RS-50 is a toughened low viscosity epoxy RTM resin which can be used in wet winding, RTM and VARTM processing. RS-50 has a long four hour pot life.

RS-1 is an epoxy prepreg which provides an excellent balance of mechanical properties, toughness and modulus. RS-1 has been evaluated and qualified in areas ranging from marine to aerospace. RS-1 is also available in a 80°C curing formulation.

ANA aerospace grade Nomex® honeycomb core is manufactured from Nomex® paper sheets, coated and bonded together with a phenolic resin. It offers high strength to weight properties at relatively low cost and, FST performance where required.

MS-1H is carbon fiber / epoxy resin compression molding system using high modulus PAN carbon fiber. MS-1H is an excellent high stiffness BMC, qualified to military and commercial applications MS-1H is offered with 1” or ½” carbon fibers for smaller parts.

MS-1A is a high-performance carbon fiber / epoxy resin compression molding system based on high modulus carbon fiber. MS-1A compression molding compound yields unparalleled stiffness and high strength. MS-1A is qualified for space applications.

BT250E-6 resin system is a 121°C (250°F) cure epoxy with excellent strength and stiffness. It provides an outstanding surface finish under vacuum bag/oven cure. BT250E-6 has an FAA-accepted database on carbon IM-7 UD tape, S2-glass, and AS-4C plain weave.

BT250E-1 is a 121°C (250°F) cure epoxy prepreg with excellent toughness and strength. It provides an outstanding surface finish with VBO. BT250E-1 is self-adhesive to honeycomb and foam core and, is MIL-R-9300 qualified.