Products

Toray MicroPly™ TCF4050 core splice adhesive is a cyanate ester-based core splice with flatwise tensile strength up to 260°C (500°F). This product has been developed to be compatible with Toray’s high temperature TC420 prepreg resin systems.

Toray MicroPly™ TCF4045 is a low-density epoxy syntactic film. It displays both good mechanical and low dielectric loss and constant properties. The material's base resin chemistry features low moisture absorption with good high temperature properties.

Toray MicroPly™ TCF4035 is a syntactic epoxy film compatible with 121°C (250°F) prepregs. It features a long out time and is offered in a density of approximately 0.6 g/cc (40 ± 4 pounds per cubic foot).

Toray MicroPly™ TCF4001 cyanate ester syntactic foam is unique in the industry due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and can be machined to shape.

Toray MicroPly™ TC310 is a toughened epoxy film adhesive with excellent mechanical properties and toughness. It is ideal for honeycomb or laminate bonding and may be cured in either autoclave or vacuum bag processing.

Toray MicroPly™ TC263 is a toughened, high peel strength, structural epoxy film adhesive for honeycomb core and laminate bonding. It may be used in low pressure vacuum only, out-of-autoclave processes or in autoclave processes at 15 psi.

Toray MicroPly SC72A is a low-density unsupported epoxy syntactic core. Offering reduced processing, a one-shot cure, the ability to anchor inserts or fastenings & increases the opportunity to consider lightweight, thin-walled composite sandwich structures

Toray MicroPly™ EX-1516 cyanate ester film adhesive which has been formulated for low moisture absorption and / or low dielectric constant and loss applications. It provides strength and toughness when bonding solid, honeycomb or foam core structures.

Toray Cetex® TC1130 is a high-end thermoplastic composite, utilizing the amorphous PolyEtherSulphone (PESU) polymer for outstanding toughness and an inherently outstanding fire, smoke, and toxicity performance (< 15/15 OSU).

Toray AmberTool® HX40 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 190ºC (374ºF) is achieved. Toray AmberTool® HX40 is ideal for high temperature larger scale tooling.

Toray TC750 is a toughened epoxy component prepreg developed for structural applications within high performance automotive. TC750 facilitates curing from 80°C (176°F) to 180°C (356°F) and can be pre-impregnated into a range of fiberand fabric types.

TC420 is a flow controlled cyanate ester prepreg, toughened to resist microcracking. TC420 is ideal for out of autoclave large structures in ultra high temperature applications. It is easy to process and yields a low void content under vacuum bag only.

TC350-1 is a toughened epoxy prepreg with mechanical property translation and excellent hot/wet performance. TC350-1 is easily processed via out of autoclave or press curing operations. TC350-1 is available in extensive fiber reinforcement formats.

RS-8HT is a BMI resin which provides excellent elevated temperature properties and processability. RS-8HT has been evaluated and qualified in the areas of satellite and airframe / missile structures.

RS-17B is a modified epoxy prepreg. RS-17B delivers extremely low moisture absorption, excellent mechanical properties, toughness, and modulus. RS-17B is a flexible cure system which may be cured from 135°C-177°C. RS-17B has a long space flight heritage.

RS-1 is an epoxy prepreg which provides an excellent balance of mechanical properties, toughness and modulus. RS-1 has been evaluated and qualified in areas ranging from marine to aerospace. RS-1 is also available in a 80°C curing formulation.

E732 is a snap cure toughened epoxy resin matrix optimized for press curing (compression molding) prepreg applications. With a cure time of 4 minutes at 160°C (320°F), an onset Tg of 170°C (338°F) is achieved.

E726 is a 120°C (248°F) cure toughened epoxy prepreg with controlled flow. E726 is designed for use within medical and industrial applications. E726 is compatible for co-cure with EF72 film adhesive and Amlite SC72A syntactic core.

E720 is a 120°C (248°F) cure toughened epoxy prepreg. E720 offers excellent adhesive properties, allowing direct lamination to honeycomb without the use of a film adhesive.

BTCy-2 is our lowest dielectric cyanate ester prepreg resin system. This resin system is valued in high-energy microwave applications due to the low loss tangent.

BTCy-1 is a 177°C (350°F) curing cyanate ester prepreg and is an industry standard for use on satellite structures and radomes.

BT250E-6 resin system is a 121°C (250°F) cure epoxy with excellent strength and stiffness. It provides an outstanding surface finish under vacuum bag/oven cure. BT250E-6 has an FAA-accepted database on carbon IM-7 UD tape, S2-glass, and AS-4C plain weave.

BT250E-1 is a 121°C (250°F) cure epoxy prepreg with excellent toughness and strength. It provides an outstanding surface finish with VBO. BT250E-1 is self-adhesive to honeycomb and foam core and, is MIL-R-9300 qualified.

8020-FR is a modified epoxy component prepreg offers excellent structural properties, flame retardancy, and toughness. The Toray 8020-FR resin system has been developed to offer a long out life and flexible cure schedules from 70–120°C (158–248°F).

8020 toughened epoxy component prepreg offers an excellent balance of mechanical properties and excellent surface finish. The Toray 8020 resin system has been developed to offer a long outlife and flexible cure schedules from 70-130°C (158-266°F).