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Toray MicroPly™ TC4015
Toray MicroPly™ TC4015 cyanate ester film adhesive, formulated for low moisture absorption and high temperature bond strength applications. Its strength and toughness when bonding is often greater than epoxy and polyimides especially at high temperatures.
Toray MicroPly™ TC310
Toray MicroPly™ TC310 is a toughened epoxy film adhesive with excellent mechanical properties and toughness. It is ideal for honeycomb or laminate bonding and may be cured in either autoclave or vacuum bag processing.
Toray MicroPly™ TC263
Toray MicroPly™ TC263 is a toughened, high peel strength, structural epoxy film adhesive for honeycomb core and laminate bonding. It may be used in low pressure vacuum only, out-of-autoclave processes or in autoclave processes at 15 psi.
Toray Cetex® MC1200
Toray Cetex® MC1200 PEEK is a thermoplastic BMC based upon TC1200 UD tape using high strength fibers in lengths of up to 25.4mm (1"). MC1200 allows complex shapes to be made with varying wall thickness, integrated ribs and reinforcing structures.
Toray Cetex® MC1100
Toray Cetex® MC1100 PPS is a thermoplastic BMC based on TC1100 UD tape using high strength fibers in lengths of up to 25.4mm (1 inch). MC1100 also allows complex shapes to be made with varying wall thickness, integrated ribs and reinforcing structures.
Toray AmberTool® HX42
Toray AmberTool® HX42 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 210°C (410°F) is achieved. Toray AmberTool® HX42 has proven pedigree in aerospace tooling.
Toray AmberTool® HX40
Toray AmberTool® HX40 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 190ºC (374ºF) is achieved. Toray AmberTool® HX40 is ideal for high temperature larger scale tooling.
TC420
TC420 is a flow controlled cyanate ester prepreg, toughened to resist microcracking. TC420 is ideal for out of autoclave large structures in ultra high temperature applications. It is easy to process and yields a low void content under vacuum bag only.
TC380 New
TC380 is a toughened epoxy prepreg, balanced with excellent OHC, OHT, CAI, and GIC/GIIC properties, low moisture absorption and outstanding hot/wet retention. TC380 is optimized to facilitate the construction of large or complex composite assemblies.
TC350-1
TC350-1 is a toughened epoxy prepreg with mechanical property translation and excellent hot/wet performance. TC350-1 is easily processed via out of autoclave or press curing operations. TC350-1 is available in extensive fiber reinforcement formats.
TC275-1E New
TC275-1E is a dual cure toughened epoxy prepreg designed to facilitate a thick or larger composite part construction with low pressure or vacuum pressure cures. The resin system features a 28 day total out time.
TC275-1
TC275-1 is a dual cure toughened epoxy prepreg designed to facilitate composite part construction with low pressure or vacuum pressure cures. TC275-1’s out time allows the lay-up of thick or larger composite structure.
TC250
Toray’s TC250 offers an excellent balance of toughness, mechanical properties, and hot/wet performance. It is easily processed via low pressure vacuum bag/oven or under autoclave. TC250 can be post cured for a higher dry and wet Tg.
RS-8HT
RS-8HT is a BMI resin which provides excellent elevated temperature properties and processability. RS-8HT has been evaluated and qualified in the areas of satellite and airframe / missile structures.
RS-50
RS-50 is a toughened low viscosity epoxy RTM resin which can be used in wet winding, RTM and VARTM processing. RS-50 has a long four hour pot life.
MS-4H
MS-4H is carbon fiber / epoxy resin compression molding system using high strength, standard modulus (HS) carbon fiber. MS-4H is an excellent low cost, high performance BMC and processes very well in medium to large heavy parts.
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At Toray our goal is your success. If you have any questions or would like to learn more, please contact us.
Toray Advanced Composites UK
Need more information?
At Toray our goal is your success. If you have any questions or would like to learn more, please contact us.