Products

Toray MicroPly™ TCF4050 core splice adhesive is a cyanate ester-based core splice with flatwise tensile strength up to 260°C (500°F). This product has been developed to be compatible with Toray’s high temperature TC420 prepreg resin systems.

Toray MicroPly™ TCF4045 is a low-density epoxy syntactic film. It displays both good mechanical and low dielectric loss and constant properties. The material's base resin chemistry features low moisture absorption with good high temperature properties.

Toray MicroPly™ TCF4035 is a syntactic epoxy film compatible with 121°C (250°F) prepregs. It features a long out time and is offered in a density of approximately 0.6 g/cc (40 ± 4 pounds per cubic foot).

Toray MicroPly™ TCF4001 cyanate ester syntactic foam is unique in the industry due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and can be machined to shape.

Toray MicroPly™ SF-5 is a cyanate ester based syntactic film with compatibility to various cyanate ester matrices, including troray RS-3. It is available in unsupported and supported continuous film form in thicknesses from 0.25–6.35 mm (10–250 mils).

Toray MicroPly™ SF-4 is a BMI syntactic film with excellent elevated temperature properties and compatibility to Toray RS-8HT. It is available in unsupported and supported continuous film form in thicknesses from 0.25–2.5 mm (10–100 mils).

MicroPly SC8020A low-density unsupported epoxy syntactic core. SC8020A offers reduced processing, a one-shot cure, the ability to anchor inserts or fastenings, and increases the opportunity to consider lightweight, thin walled composite sandwich structures

Toray MicroPly SC72A is a low-density unsupported epoxy syntactic core. Offering reduced processing, a one-shot cure, the ability to anchor inserts or fastenings & increases the opportunity to consider lightweight, thin-walled composite sandwich structures

Toray MicroPly™ EX-1541 cyanate ester syntactic foam is unique due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and is easily machined to shape if required.

MicroPly™ ES72A-2 low-density, expanding, unsupported, epoxy syntactic core. Offering reduced processing, a one-shot cure, the ability to anchor inserts / fastenings and, the opportunity to consider lightweight, thin walled composite sandwich structures.

Toray MicroPly™ EM-5A is an expanding cyanate ester syntactic film (core splice). Its' unexpanded density is approximately 0.80 g/cc (50 pcf) and it exhibits an expansion ratio of up to 4 times. It is available in continuous film rolls or in sheet form.

Toray MicroPly™ EM-3 is a 121°C (250°F) curing expanding epoxy film of controlled thickness, based on low density syntactic film technology. It is an effective material in generating internal pressure in a closed mold application.