Products

Toray MicroPly™ TCF4050 core splice adhesive is a cyanate ester-based core splice with flatwise tensile strength up to 260°C (500°F). This product has been developed to be compatible with Toray’s high temperature TC420 prepreg resin systems.

Toray MicroPly™ TCF4045 is a low-density epoxy syntactic film. It displays both good mechanical and low dielectric loss and constant properties. The material's base resin chemistry features low moisture absorption with good high temperature properties.

Toray MicroPly™ TCF4035 is a syntactic epoxy film compatible with 121°C (250°F) prepregs. It features a long out time and is offered in a density of approximately 0.6 g/cc (40 ± 4 pounds per cubic foot).

Toray MicroPly™ TCF4001 cyanate ester syntactic foam is unique in the industry due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and can be machined to shape.

Toray MicroPly™ TC4015 cyanate ester film adhesive, formulated for low moisture absorption and high temperature bond strength applications. Its strength and toughness when bonding is often greater than epoxy and polyimides especially at high temperatures.

Toray MicroPly™ TC310 is a toughened epoxy film adhesive with excellent mechanical properties and toughness. It is ideal for honeycomb or laminate bonding and may be cured in either autoclave or vacuum bag processing.

Toray MicroPly™ TC263 is a toughened, high peel strength, structural epoxy film adhesive for honeycomb core and laminate bonding. It may be used in low pressure vacuum only, out-of-autoclave processes or in autoclave processes at 15 psi.

Toray MicroPly™ SF-4 is a BMI syntactic film with excellent elevated temperature properties and compatibility to Toray RS-8HT. It is available in unsupported and supported continuous film form in thicknesses from 0.25–2.5 mm (10–100 mils).

Toray MicroPly™ RS-4A is a cyanate ester based film adhesive developed to provide good adhesive performance for core / face skin structures, co-curing and secondary bonding.

Toray MicroPly™ EX-1543 cyanate ester film adhesive formulated for low moisture absorption and/or low dielectric constant and loss applications. It provides strength and toughness when bonding solid, honeycomb or foam core structures at high temperatures.

Toray MicroPly™ EX-1541 cyanate ester syntactic foam is unique due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and is easily machined to shape if required.

Toray MicroPly™ EX-1516 cyanate ester film adhesive which has been formulated for low moisture absorption and / or low dielectric constant and loss applications. It provides strength and toughness when bonding solid, honeycomb or foam core structures.

Toray MicroPly™ EM-5A is an expanding cyanate ester syntactic film (core splice). Its' unexpanded density is approximately 0.80 g/cc (50 pcf) and it exhibits an expansion ratio of up to 4 times. It is available in continuous film rolls or in sheet form.

Toray Cetex® TC1225 is an engineered thermoplastic composite material, utilizing a semi-crystalline engineered polyarlyetherketone resin for excellent mechanical performance and lower processing temperatures.

Toray AmberTool® HX42 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 210°C (410°F) is achieved. Toray AmberTool® HX42 has proven pedigree in aerospace tooling.

Toray AmberTool® HX40 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 190ºC (374ºF) is achieved. Toray AmberTool® HX40 is ideal for high temperature larger scale tooling.

TC890 is a very high temperature polyimide prepreg utilizing PROOF 900HT resin system. It has a service temperature capability up to 427°C (800°F). It displays exceptional toughness, superb low dielectric loss properties and is thermally stable.

Toray TC522 is a highly toughened modified epoxy resin system. TC522 displays outstanding Compression After Impact (CAI), setting it apart from other resins designed for dielectric applications.

TC420 is a flow controlled cyanate ester prepreg, toughened to resist microcracking. TC420 is ideal for out of autoclave large structures in ultra high temperature applications. It is easy to process and yields a low void content under vacuum bag only.

Toray’s TC250 offers an excellent balance of toughness, mechanical properties, and hot/wet performance. It is easily processed via low pressure vacuum bag/oven or under autoclave. TC250 can be post cured for a higher dry and wet Tg.

RS-8HT is a BMI resin which provides excellent elevated temperature properties and processability. RS-8HT has been evaluated and qualified in the areas of satellite and airframe / missile structures.

RS-3 is a modified cyanate ester prepreg, providing a good balance between toughness and high temperature/wet performance. RS-3 is qualified in satellite, airframe/missile and, radome structures. RS-3C is a controlled flow vacuum bag only cure version.

BTCy-2 is our lowest dielectric cyanate ester prepreg resin system. This resin system is valued in high-energy microwave applications due to the low loss tangent.

BTCy-1 is a 177°C (350°F) curing cyanate ester prepreg and is an industry standard for use on satellite structures and radomes.

BT250E-1 is a 121°C (250°F) cure epoxy prepreg with excellent toughness and strength. It provides an outstanding surface finish with VBO. BT250E-1 is self-adhesive to honeycomb and foam core and, is MIL-R-9300 qualified.