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Product description

TC890 high temperature polyimide prepreg system utilizes PROOF Research Advanced Composites Division 900HT resin system. TC890 is a high temperature, polyimide-based thermoset prepreg with outstanding dry property retention at 343°C (650°F), wet service property retention at 288°C (550°F), and short-term and intermittent service temperature capability to 427°C (800°F). TC890 has been successfully demonstrated in short term, transient heating applications to temperatures as high as 1300°F. TC890 is an excellent non-MDA replacement for high temperature PMR-15 applications.

TC890 prepreg system is easily processable and thermally stable, exhibiting the highest glass transition temperature of commercially available structural matrices. This system displays exceptional toughness, excellent dielectric properties, and low toxicity.

Product benefits/features

  • Non MDA PMR-15 replacement
  • Short term service temperature capability of 538°C (1000°F)

Market segments

  • High Temperature
  • Aerostructures
  • Radome


Product category Thermoset Prepreg
Processing Autoclave
Resin type Polyimide
Tg (Dry, onset) 454 °C / 849 °F
Cure temperature (Optimal) 371 °C / 699 °F
Cure temperature (Lowest)371 °C / 699 °F
Cure temperature (Highest)371 °C / 699 °F
Out life 30 days

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