Toray MicroPly™ EF72

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Product description

Toray MicroPly™ EF72 is a modified, high strength, structural epoxy film adhesive for metal to metal or sandwich core to skin bonds. EF72 has a strong self-filleting action in honeycomb-to-skin bonds.

Toray MicroPly™ Toray EF72 film adhesive is protected on one side by a release paper and on the other by a polythene separator. A lightweight polyester carrier is incorporated into the adhesive film to ensure easy handling while cutting and positioning.

Toray MicroPly™ EF72 is compatible for co-cure with many of Toray’s E700 series prepregs that cure at 120°C.

Product benefits/features

  • Accurate control of adhesive distribution
  • Excellent filleting to honeycomb core
  • Ideal for metal or composite bonding

Market segments

  • Sport & recreation
  • Motorsport & Formula 1
  • Automotive
  • Energy
  • Medical
  • Industrial


Product category Film adhesives
Processing Out of Autoclave / Vacuum bag
Press forming
Resin type Epoxy
Tg (Dry, onset) 112 °C / 233 °F
Cure temperature (Optimal) 120 °C / 248 °F
Cure temperature (Lowest)120 °C / 248 °F
Cure temperature (Highest)120 °C / 248 °F
Out life 30 days

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