Products

Toray MicroPly™ TCF4050 core splice adhesive is a cyanate ester-based core splice with flatwise tensile strength up to 260°C (500°F). This product has been developed to be compatible with Toray’s high temperature TC420 prepreg resin systems.

Toray MicroPly™ TCF4001 cyanate ester syntactic foam is unique in the industry due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and can be machined to shape.

Toray MicroPly™ SF-5 is a cyanate ester based syntactic film with compatibility to various cyanate ester matrices, including troray RS-3. It is available in unsupported and supported continuous film form in thicknesses from 0.25–6.35 mm (10–250 mils).

Toray MicroPly™ EX-1541 cyanate ester syntactic foam is unique due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and is easily machined to shape if required.

Toray MicroPly™ EF8020 is a modified, high-strength, structural epoxy film adhesive for honeycomb core and laminate bonding. EF8020 is compatible for co-cure with Toray’s 8020 prepreg and SC8020 syntactic core.

Toray Cetex® TC960 is a polypropylene (PP) composite designed for applications requiring high impact resistance, but where cost is a factor. The impact toughness of TC960 makes it ideal for use in truck bodies, vehicles and vehicle enclosures.

Toray Cetex® TC910 is a high strength thermoplastic composite using a polyamide 6 (PA6) matrix resin designed for applications such as automotive and transportation. It provides good heat distortion temperatures and excellent solvent resistance.

Toray Cetex® TC1320 is an engineered thermoplastic composite, utilizing a semi-crystalline polyetherketoneketone resin for outstanding toughness and excellent fire performance.

Toray Cetex® TC1225 is a high-end thermoplastic composite material, utilizing a semi-crystalline low-melt polyarlyetherketone resin with excellent mechanical performance and lower processing temperatures.

Toray Cetex® TC1100 is a high-end but cost-effective thermoplastic composite material, utilizing a PPS polymer for excellent mechanical properties and an outstanding chemical and solvent resistance. Qualified for structural application at airframe OEMs.

Toray Cetex® MC1200 PEEK is a thermoplastic BMC based upon TC1200 UD tape using high strength fibers in lengths of up to 25.4mm (1"). MC1200 allows complex shapes to be made with varying wall thickness, integrated ribs and reinforcing structures.

Toray AmberTool® HX40 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 190ºC (374ºF) is achieved. Toray AmberTool® HX40 is ideal for high temperature larger scale tooling.

TC380 is a toughened epoxy prepreg, balanced with excellent OHC, OHT, CAI, and GIC/GIIC properties, low moisture absorption and outstanding hot/wet retention. TC380 is optimized to facilitate the construction of large or complex composite assemblies.

TC275-1E is a dual cure toughened epoxy prepreg designed to facilitate a thick or larger composite part construction with low pressure or vacuum pressure cures. The resin system features a 28 day total out time.

RS-50 is a toughened low viscosity epoxy RTM resin which can be used in wet winding, RTM and VARTM processing. RS-50 has a long four hour pot life.

Toray’s Nomex® aerospace grade honeycomb core is manufactured from Nomex® paper sheets, coated and bonded together with a phenolic resin. It offers high strength to weight properties at relatively low cost and, FST performance where required.

MS-1H is carbon fiber / epoxy resin compression molding system using high modulus PAN carbon fiber. MS-1H is an excellent high stiffness BMC, qualified to military and commercial applications MS-1H is offered with 1” or ½” carbon fibers for smaller parts.

EX-1522 is a toughened modified epoxy prepreg. EX-1522 displays very low moisture absorption, also excellent mechanical and thermal properties. EX-1522 has a flammability rating of V-0, which lends itself to usage in low flammability applications.

E760 is a highly toughened epoxy component prepreg with exceptional high temperature performance. E760 has been designed for use in mechanically demanding structural applications exposed to elevated temperature environments e.g. Formula 1.

E750 is a toughened epoxy component prepreg developed for structural applications within Formula 1 and high performance automotive. E750 allows curing from 80°C (176°F) to 180°C (356°F) and can be impregnated into a range of fiber and fabric types.

E731 is a toughened epoxy component prepreg designed to deliver enhanced resin clarity for cosmetic components within high performance automotive. The E731 resin formulation ensures that components are free from white-spots and exhibit high clarity.

E720 is a 120°C (248°F) cure toughened epoxy prepreg. E720 offers excellent adhesive properties, allowing direct lamination to honeycomb without the use of a film adhesive.

BTCy-2 is our lowest dielectric cyanate ester prepreg resin system. This resin system is valued in high-energy microwave applications due to the low loss tangent.

BT250E-1 is a 121°C (250°F) cure epoxy prepreg with excellent toughness and strength. It provides an outstanding surface finish with VBO. BT250E-1 is self-adhesive to honeycomb and foam core and, is MIL-R-9300 qualified.

8020 toughened epoxy component prepreg offers an excellent balance of mechanical properties and excellent surface finish. The Toray 8020 resin system has been developed to offer a long outlife and flexible cure schedules from 70-130°C (158-266°F).