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Product description

EM-3 is a 121°C (250°F) curing expanding epoxy film based on low density syntactic film technology. It is an effective material in generating internal pressure in a closed mold application.

EM-3 is available as a continuous low-density film of controlled thickness.

Product benefits/features

  • High expansion (8-10 x) 0.64 g/cc (40 pcf) density
  • Tg estimated from base resin data

Market segments

  • Space & Satellite
  • Aerostructures
  • Radome


Product category Syntactics
Processing Autoclave
Resin type Epoxy
Tg (Dry, onset) 116 °C / 241 °F
Cure temperature (Optimal) 121 °C / 250 °F
Cure temperature (Lowest)121 °C / 250 °F
Cure temperature (Highest)121 °C / 250 °F
Out life 30 days

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