Products

Toray MicroPly™ TCF4050 core splice adhesive is a cyanate ester-based core splice with flatwise tensile strength up to 260°C (500°F). This product has been developed to be compatible with Toray’s high temperature TC420 and EX-1505 prepreg resin systems.

Toray MicroPly™ TCF4001 cyanate ester syntactic foam is unique in the industry due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and can be machined to shape.

Toray MicroPly™ TC4015 cyanate ester film adhesive, formulated for low moisture absorption and high temperature bond strength applications. Its strength and toughness when bonding is often greater than epoxy and polyimides especially at high temperatures.

Toray MicroPly™ TC310 is a toughened epoxy film adhesive with excellent mechanical properties and toughness. It is ideal for honeycomb or laminate bonding and may be cured in either autoclave or vacuum bag processing.

Toray MicroPly™ TC263 is a toughened, high peel strength, structural epoxy film adhesive for honeycomb core and laminate bonding. It may be used in low pressure vacuum only, out-of-autoclave processes or in autoclave processes at 15 psi.

Toray MicroPly™ SF-5 is a cyanate ester based syntactic film with compatibility to various cyanate ester matrices, including troray RS-3. It is available in unsupported and supported continuous film form in thicknesses from 0.25–6.35 mm (10–250 mils).

Toray MicroPly™ SF-4 is a BMI syntactic film with excellent elevated temperature properties and compatibility to Toray RS-8HT. It is available in unsupported and supported continuous film form in thicknesses from 0.25–2.5 mm (10–100 mils).

Toray MicroPly™ EX-1541 cyanate ester syntactic foam is unique due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and is easily machined to shape if required.

Toray MicroPly™ EX-1516 cyanate ester film adhesive which has been formulated for low moisture absorption and / or low dielectric constant and loss applications. It provides strength and toughness when bonding solid, honeycomb or foam core structures.

Toray MicroPly™ EM-3 is a 121°C (250°F) curing expanding epoxy film of controlled thickness, based on low density syntactic film technology. It is an effective material in generating internal pressure in a closed mold application.

Toray Cetex® MC1100 PPS is a thermoplastic BMC based on TC1100 UD tape using high strength fibers in lengths of up to 25.4mm (1 inch). MC1100 also allows complex shapes to be made with varying wall thickness, integrated ribs and reinforcing structures.

Toray AmberTool® HX42 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 190ºC (374ºF) is achieved. Toray AmberTool® HX42 has proven pedigree in aerospace tooling.

TC420 is a flow controlled cyanate ester prepreg, toughened to resist microcracking. TC420 is ideal for out of autoclave large structures in ultra high temperature applications. It is easy to process and yields a low void content under vacuum bag only.

TC410 cyanate ester prepreg achieves extremely low moisture absorption and high conversion levels. TC410 is designed specifically for radomes and satellite structures, providing good resistance to radiation, low microcracking and, low dielectric and loss.

TC275-1E is a dual cure toughened epoxy prepreg designed to facilitate a thick or larger composite part construction with low pressure or vacuum pressure cures. The resin system features a 28 day total out time.

TC275-1 is a dual cure toughened epoxy prepreg designed to facilitate composite part construction with low pressure or vacuum pressure cures. TC275-1’s out time allows the lay-up of thick or larger composite structure.

RS-36 is an advanced modified epoxy prepreg for structural composite applications. RS-36 offers an excellent balance of mechanical properties, low moisture absorption and a range of processing options. For a higher Tg, RS-36-1 is available

RS-3 is a modified cyanate ester prepreg, providing a good balance between toughness and high temperature/wet performance. RS-3 is qualified in satellite, airframe/missile and, radome structures. RS-3C is a controlled flow vacuum bag only cure version.

RS-17B is a modified epoxy prepreg. RS-17B delivers extremely low moisture absorption, excellent mechanical properties, toughness, and modulus. RS-17B is a flexible cure system which may be cured from 135°C-177°C. RS-17B has a long space flight heritage.

RS-16 is a two-part low viscosity cyanate ester RTM resin for wet winding, RTM and VARTM processing. RS-16 is intended for lower temperature exposure and is an ideal system when used with different materials limiting the upper cure temperature.

EX-1545 is a toughened two-part cyanate ester resin with extremely low viscosity at room temperature, allowing RTM to take place with minimal resin heating. This facilitates mold filling time for difficult and / or large RTM’d structures and reduces waste.

EX-1522 is a toughened modified epoxy prepreg. EX-1522 displays very low moisture absorption, also excellent mechanical and thermal properties. EX-1522 has a flammability rating of V-0, which lends itself to usage in low flammability applications.

EX-1515 cyanate ester prepreg provides optimal mechanical properties, high radiation resistance, microcracking resistance, low moisture absorption / low outgassing while retaining toughness, a low 244°F (118°C) stress-free temperature and long out time.

EX-1510 is a toughened two-part cyanate ester resin with extremely low viscosity at room temperature, allowing RTM to take place without heating the resin. This facilitates mold filling time for difficult and / or large RTM’d structures and reduces waste.

BTCy-1A is a toughened cyanate ester prepreg. BTCy-1A’s straight-up, easy processing at 177°C (350°F) under low pressure, reduces curing time and production costs, while the system’s negligible volatile emission upon cure allows low void laminates.