Products

Toray MicroPly™ TCF4050 core splice adhesive is a cyanate ester-based core splice with flatwise tensile strength up to 260°C (500°F). This product has been developed to be compatible with Toray’s high temperature TC420 prepreg resin systems.

Toray MicroPly™ TCF4035 is a syntactic epoxy film compatible with 121°C (250°F) prepregs. It features a long out time and is offered in a density of approximately 0.6 g/cc (40 ± 4 pounds per cubic foot).

Toray MicroPly™ TCF4001 cyanate ester syntactic foam is unique in the industry due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and can be machined to shape.

Toray MicroPly™ TC4015 cyanate ester film adhesive, formulated for low moisture absorption and high temperature bond strength applications. Its strength and toughness when bonding is often greater than epoxy and polyimides especially at high temperatures.

Toray MicroPly™ TC310 is a toughened epoxy film adhesive with excellent mechanical properties and toughness. It is ideal for honeycomb or laminate bonding and may be cured in either autoclave or vacuum bag processing.

Toray MicroPly™ TC263 is a toughened, high peel strength, structural epoxy film adhesive for honeycomb core and laminate bonding. It may be used in low pressure vacuum only, out-of-autoclave processes or in autoclave processes at 15 psi.

Toray MicroPly™ SF-4 is a BMI syntactic film with excellent elevated temperature properties and compatibility to Toray RS-8HT. It is available in unsupported and supported continuous film form in thicknesses from 0.25–2.5 mm (10–100 mils).

Toray MicroPly™ RS-4A is a cyanate ester based film adhesive developed to provide good adhesive performance for core / face skin structures, co-curing and secondary bonding.

Toray MicroPly™ EX-1543 cyanate ester film adhesive formulated for low moisture absorption and/or low dielectric constant and loss applications. It provides strength and toughness when bonding solid, honeycomb or foam core structures at high temperatures.

Toray MicroPly™ EX-1541 cyanate ester syntactic foam is unique due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and is easily machined to shape if required.

Toray MicroPly™ EX-1516 cyanate ester film adhesive which has been formulated for low moisture absorption and / or low dielectric constant and loss applications. It provides strength and toughness when bonding solid, honeycomb or foam core structures.

Toray MicroPly™ EM-5A is an expanding cyanate ester syntactic film (core splice). Its' unexpanded density is approximately 0.80 g/cc (50 pcf) and it exhibits an expansion ratio of up to 4 times. It is available in continuous film rolls or in sheet form.

Toray Cetex® MC1200 PEEK is a thermoplastic BMC based upon TC1200 UD tape using high strength fibers in lengths of up to 25.4mm (1"). MC1200 allows complex shapes to be made with varying wall thickness, integrated ribs and reinforcing structures.

Toray Cetex® MC1100 PPS is a thermoplastic BMC based on TC1100 UD tape using high strength fibers in lengths of up to 25.4mm (1 inch). MC1100 also allows complex shapes to be made with varying wall thickness, integrated ribs and reinforcing structures.

Toray AmberTool® HX42 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 210°C (410°F) is achieved. Toray AmberTool® HX42 has proven pedigree in aerospace tooling.

Toray AmberTool® HX40 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 190ºC (374ºF) is achieved. Toray AmberTool® HX40 is ideal for high temperature larger scale tooling.

TC420 is a flow controlled cyanate ester prepreg, toughened to resist microcracking. TC420 is ideal for out of autoclave large structures in ultra high temperature applications. It is easy to process and yields a low void content under vacuum bag only.

TC275-1 is a dual cure toughened epoxy prepreg designed to facilitate composite part construction with low pressure or vacuum pressure cures. TC275-1’s out time allows the lay-up of thick or larger composite structure.

RS-36 is an advanced modified epoxy prepreg for structural composite applications. RS-36 offers an excellent balance of mechanical properties, low moisture absorption and a range of processing options. For a higher Tg, RS-36-1 is available

RS-3 is a modified cyanate ester prepreg, providing a good balance between toughness and high temperature/wet performance. RS-3 is qualified in satellite, airframe/missile and, radome structures. RS-3C is a controlled flow vacuum bag only cure version.

RS-17B is a modified epoxy prepreg. RS-17B delivers extremely low moisture absorption, excellent mechanical properties, toughness, and modulus. RS-17B is a flexible cure system which may be cured from 135°C-177°C. RS-17B has a long space flight heritage.

MS-1H is carbon fiber / epoxy resin compression molding system using high modulus PAN carbon fiber. MS-1H is an excellent high stiffness BMC, qualified to military and commercial applications MS-1H is offered with 1” or ½” carbon fibers for smaller parts.

MS-1A is a high-performance carbon fiber / epoxy resin compression molding system based on high modulus carbon fiber. MS-1A compression molding compound yields unparalleled stiffness and high strength. MS-1A is qualified for space applications.

EX-1522 is a toughened modified epoxy prepreg. EX-1522 displays very low moisture absorption, also excellent mechanical and thermal properties. EX-1522 has a flammability rating of V-0, which lends itself to usage in low flammability applications.

EX-1510 is a toughened two-part cyanate ester resin with extremely low viscosity at room temperature, allowing RTM to take place without heating the resin. This facilitates mold filling time for difficult and / or large RTM’d structures and reduces waste.