Products

Toray MicroPly™ TCF4050 core splice adhesive is a cyanate ester-based core splice with flatwise tensile strength up to 260°C (500°F). This product has been developed to be compatible with Toray’s high temperature TC420 prepreg resin systems.

Toray MicroPly™ TCF4045 is a low-density epoxy syntactic film. It displays both good mechanical and low dielectric loss and constant properties. The material's base resin chemistry features low moisture absorption with good high temperature properties.

Toray MicroPly™ TCF4035 is a syntactic epoxy film compatible with 121°C (250°F) prepregs. It features a long out time and is offered in a density of approximately 0.6 g/cc (40 ± 4 pounds per cubic foot).

Toray MicroPly™ TCF4001 cyanate ester syntactic foam is unique in the industry due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and can be machined to shape.

Toray MicroPly™ TC4015 cyanate ester film adhesive, formulated for low moisture absorption and high temperature bond strength applications. Its strength and toughness when bonding is often greater than epoxy and polyimides especially at high temperatures.

Toray MicroPly™ TC310 is a toughened epoxy film adhesive with excellent mechanical properties and toughness. It is ideal for honeycomb or laminate bonding and may be cured in either autoclave or vacuum bag processing.

Toray MicroPly™ TC263 is a toughened, high peel strength, structural epoxy film adhesive for honeycomb core and laminate bonding. It may be used in low pressure vacuum only, out-of-autoclave processes or in autoclave processes at 15 psi.

Toray MicroPly™ TC235SF-1 is an epoxy composite surfacing film, allowing a smooth, paintable surface from tooling or, a thin-skinned honeycomb stiffened composite structure. It may be cured under vacuum only pressure or under low autoclave pressure.

Toray MicroPly™ EX-1543 cyanate ester film adhesive formulated for low moisture absorption and/or low dielectric constant and loss applications. It provides strength and toughness when bonding solid, honeycomb or foam core structures at high temperatures.

Toray MicroPly™ EX-1516 cyanate ester film adhesive which has been formulated for low moisture absorption and / or low dielectric constant and loss applications. It provides strength and toughness when bonding solid, honeycomb or foam core structures.

TC420 is a flow controlled cyanate ester prepreg, toughened to resist microcracking. TC420 is ideal for out of autoclave large structures in ultra high temperature applications. It is easy to process and yields a low void content under vacuum bag only.

TC350-1 is a toughened epoxy prepreg with mechanical property translation and excellent hot/wet performance. TC350-1 is easily processed via out of autoclave or press curing operations. TC350-1 is available in extensive fiber reinforcement formats.

TC275-1 is a dual cure toughened epoxy prepreg designed to facilitate composite part construction with low pressure or vacuum pressure cures. TC275-1’s out time allows the lay-up of thick or larger composite structure.

Toray’s TC250 offers an excellent balance of toughness, mechanical properties, and hot/wet performance. It is easily processed via low pressure vacuum bag/oven or under autoclave. TC250 can be post cured for a higher dry and wet Tg.

RS-36 is an advanced modified epoxy prepreg for structural composite applications. RS-36 offers an excellent balance of mechanical properties, low moisture absorption and a range of processing options. For a higher Tg, RS-36-1 is available

RS-17B is a modified epoxy prepreg. RS-17B delivers extremely low moisture absorption, excellent mechanical properties, toughness, and modulus. RS-17B is a flexible cure system which may be cured from 135°C-177°C. RS-17B has a long space flight heritage.

RS-1 is an epoxy prepreg which provides an excellent balance of mechanical properties, toughness and modulus. RS-1 has been evaluated and qualified in areas ranging from marine to aerospace. RS-1 is also available in a 80°C curing formulation.

E732 is a snap cure toughened epoxy resin matrix optimized for press curing (compression molding) prepreg applications. With a cure time of 4 minutes at 160°C (320°F), an onset Tg of 170°C (338°F) is achieved.

E726 is a 120°C (248°F) cure toughened epoxy prepreg with controlled flow. E726 is designed for use within medical and industrial applications. E726 is compatible for co-cure with EF72 film adhesive and Amlite SC72A syntactic core.

E722 is a 120°C (248°F) cure toughened epoxy component prepreg. E722 is designed for structural applications in motorsport and marine industries and, a wide range of engineering applications.

E720 is a 120°C (248°F) cure toughened epoxy prepreg. E720 offers excellent adhesive properties, allowing direct lamination to honeycomb without the use of a film adhesive.

BT250E-6 resin system is a 121°C (250°F) cure epoxy with excellent strength and stiffness. It provides an outstanding surface finish under vacuum bag/oven cure. BT250E-6 has an FAA-accepted database on carbon IM-7 UD tape, S2-glass, and AS-4C plain weave.

BT250E-1 is a 121°C (250°F) cure epoxy prepreg with excellent toughness and strength. It provides an outstanding surface finish with VBO. BT250E-1 is self-adhesive to honeycomb and foam core and, is MIL-R-9300 qualified.

8020-FR is a modified epoxy component prepreg offers excellent structural properties, flame retardancy, and toughness. The Toray 8020-FR resin system has been developed to offer a long out life and flexible cure schedules from 70–120°C (158–248°F).

8020 toughened epoxy component prepreg offers an excellent balance of mechanical properties and excellent surface finish. The Toray 8020 resin system has been developed to offer a long outlife and flexible cure schedules from 70-130°C (158-266°F).