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Product description

TC310 is a toughened epoxy film adhesive for composite bonding with excellent mechanical properties and toughness. It is ideal for honeycomb or laminate bonding, and may be cured under autoclave or vacuum bag processing. TC310 is part of the Toray MicroPly(TM) brand of adhesives and syntactics.

Product benefits/features

  • Ideal composite bonding film adhesive

Market segments

  • High Temperature
  • Launch
  • Space & Satellite
  • Aerostructures
  • Radome


Product category Film adhesives
Processing Out of Autoclave / Vacuum bag
Press forming
Resin type Epoxy
Tg (Dry, onset) 157 °C / 314 °F
Cure temperature (Optimal) 177 °C / 350 °F
Cure temperature (Lowest)121 °C / 249 °F
Cure temperature (Highest)177 °C / 350 °F
Out life 21 days

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