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Product description

TCF4045 is a low dielectric, low density epoxy syntactic film. The material displays both good mechanical and dielectric properties. TCF4045’s base resin chemistry features low moisture absorption with good high temperature properties.

Product benefits/features

  • Excellent low dielectric loss and constant
  • Density of 0.61 g/cc (38.5 pcf)

Market segments

  • Aerostructures
  • Radome


Product category Syntactics
Processing Out of Autoclave / Vacuum bag
Resin type Epoxy
Tg (Dry, onset) 180 °C / 356 °F
Cure temperature (Optimal) 179 °C / 354 °F
Cure temperature (Lowest)127 °C / 260 °F
Cure temperature (Highest)179 °C / 354 °F
Out life 14 days

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